Acta Metallurgica Sinica(English Letters)

Acta Metallurgica Sinica(English Letters)雜志投稿須知:Manuscripts StructureReferencesThe references should be typed in the following style:?For journals: D.P. Walls and F.W. Zok, Acta Metall Mater 42(8) (1994) 2675.?For conference proceedings: H. Yasuda, I. Ohnaka, K. Shimamura, T. Fukuda and K. Watanabe, In: S. Asai ed., The 3rd Int. Symp. on Electromagnetic Processing of Materials (ISIJ, Nagoya, Japan, 2000) p.647.?For books: K.H. Kuo, H.Q. Ye and Y.K. Wu, Electron Diffraction Pattern (Science Press, Beijing, 1983) p.90 (in Chinese).?For others: (Please provide as much detail as possible)

1、 S.L. Brown and J.D. Sullivan, Dissolution of Various Copper Minerals, Report of US Bureau of Mines No.3228 (Washington, 1934).。

2、 S.C. Huang, US Patent US5324367 (6 April 1993).。

3、 L.H. Edelson, PhD Dissertation (University of California, Berkeley, 1993). Illustrations(1) Photographs should be printed in high contrast and clarity. TIFF or JPEG files are the preferred format. The minimum acceptable resolution for photographs should be 600 dpi.(2) Line drawings made with Origin or Word format generally give perfect results (much better than Excel), so authors should convert XLS files into OPJ files using ORIGIN software. TIFF files are also an acceptable format for line drawings (minimum resolutions are 300--600 dpi, after reduction the final lettering height should be no less than 2 mm). The lettering and plotted points should be legible after reduction (using Arial font, the sizes should be about 26 pt in Origin and 8 pt in Word or larger). Graphs should have axes with proper labels (according to “Quantity/Unit”, e.g., Temperature/K).